[HTML][HTML] Microstructure and properties of electromigration of Sn58Bi/Cu solder joints with different joule thermal properties
Y Gao, K Zhang, C Zhang, Y Wang, W Chen - Metals, 2023 - mdpi.com
Electromigration is one of the most important research issues affecting the reliability of
solder joints. Current-induced Joule heating affects the electromigration behavior of solder …
solder joints. Current-induced Joule heating affects the electromigration behavior of solder …
Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration
J Huang, Y Zhu, K Pan, X Wang, Z Huang, D Xiao… - Intermetallics, 2024 - Elsevier
Sn–52In eutectic solder has gradually attracted much attention due to the feature of low
melting temperature in recent years. However, Sn–52In solder may occur melting due to the …
melting temperature in recent years. However, Sn–52In solder may occur melting due to the …