Defect engineering in SiC technology for high-voltage power devices
T Kimoto, H Watanabe - Applied Physics Express, 2020 - iopscience.iop.org
Major features of silicon carbide (SiC) power devices include high blocking voltage, low on-
state loss, and fast switching, compared with those of the Si counterparts. Through recent …
state loss, and fast switching, compared with those of the Si counterparts. Through recent …
Bias temperature instability in SiC metal oxide semiconductor devices
C Yang, S Wei, D Wang - Journal of Physics D: Applied Physics, 2021 - iopscience.iop.org
Although silicon carbide (SiC) metal oxide semiconductor field-effect transistors (MOSFETs)
are commercially available, bias temperature instability (BTI) defined as shifts in V th in SiC …
are commercially available, bias temperature instability (BTI) defined as shifts in V th in SiC …
Mobility improvement of 4H-SiC (0001) MOSFETs by a three-step process of H2 etching, SiO2 deposition, and interface nitridation
Abstract 4H-SiC (0001) metal-oxide-semiconductor field-effect transistors (MOSFETs) and
MOS capacitors were fabricated by the following procedures: H 2 etching, SiO 2 deposition …
MOS capacitors were fabricated by the following procedures: H 2 etching, SiO 2 deposition …
Design and formation of SiC (0001)/SiO2 interfaces via Si deposition followed by low-temperature oxidation and high-temperature nitridation
T Kobayashi, T Okuda, K Tachiki, K Ito… - Applied Physics …, 2020 - iopscience.iop.org
We report an effective approach to reduce defects at a SiC/SiO 2 interface. Since oxidation
of SiC may inevitably lead to defect creation, the idea is to form the interface without …
of SiC may inevitably lead to defect creation, the idea is to form the interface without …
Removal of near-interface traps at SiO2/4H–SiC (0001) interfaces by phosphorus incorporation
Effective removal of near-interface traps (NITs) in SiO 2/4 H–SiC (0001) structures through
phosphorus incorporation is demonstrated in this paper. Low-temperature capacitance …
phosphorus incorporation is demonstrated in this paper. Low-temperature capacitance …
Improved channel mobility in 4H-SiC MOSFETs by boron passivation
D Okamoto, M Sometani, S Harada… - IEEE Electron …, 2014 - ieeexplore.ieee.org
We propose another process for fabricating 4H-SiC metal-oxide-semiconductor field-effect
transistors (MOSFETs) with high channel mobility. The B atoms were introduced into a SiO …
transistors (MOSFETs) with high channel mobility. The B atoms were introduced into a SiO …
Characterization of Transient Gate Oxide Trapping in SiC MOSFETs Using Fast – Techniques
M Gurfinkel, HD Xiong, KP Cheung… - … on Electron Devices, 2008 - ieeexplore.ieee.org
Threshold voltage and drain current instabilities in state-of-the-art 4H-SiC MOSFETs with
thermal as-grown SiO 2 and NO-annealed gate oxides have been studied using fast IV …
thermal as-grown SiO 2 and NO-annealed gate oxides have been studied using fast IV …
[HTML][HTML] High mobility 4H-SiC (0001) transistors using alkali and alkaline earth interface layers
Alkali (Rb and Cs) and alkaline earth (Ca, Sr, and Ba) elements have been investigated as
interface passivation materials for metal-oxide-semiconductor field-effect transistors …
interface passivation materials for metal-oxide-semiconductor field-effect transistors …
Formation of high-quality SiC (0001)/SiO2 structures by excluding oxidation process with H2 etching before SiO2 deposition and high-temperature N2 annealing
K Tachiki, M Kaneko, T Kobayashi… - Applied Physics …, 2020 - iopscience.iop.org
Abstract We formed SiC/SiO 2 structures by various procedures that excluded an oxidation
process. We found that a SiC/SiO 2 interface with a low interface state density near the …
process. We found that a SiC/SiO 2 interface with a low interface state density near the …
[HTML][HTML] Electrical characterization of amorphous Al2O3 dielectric films on n-type 4H-SiC
We report on the electrical properties of Al 2 O 3 films grown on 4H-SiC by successive
thermal oxidation of thin Al layers at low temperatures (200 C-300 C). MOS capacitors made …
thermal oxidation of thin Al layers at low temperatures (200 C-300 C). MOS capacitors made …