Deep traps in GaN-based structures as affecting the performance of GaN devices

AY Polyakov, IH Lee - Materials Science and Engineering: R: Reports, 2015 - Elsevier
New developments in theoretical studies of defects and impurities in III-Nitrides as pertinent
to compensation and recombination in these materials are discussed. New results on …

Vertical GaN power devices: Device principles and fabrication technologies—Part I

H Fu, K Fu, S Chowdhury, T Palacios… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
Recent years have witnessed a tremendous development of vertical gallium nitride (GaN)
power devices, a new class of device technology that could be the key enabler for next …

GaN-based power devices: Physics, reliability, and perspectives

M Meneghini, C De Santi, I Abid, M Buffolo… - Journal of Applied …, 2021 - pubs.aip.org
Over the last decade, gallium nitride (GaN) has emerged as an excellent material for the
fabrication of power devices. Among the semiconductors for which power devices are …

Effects of carbon on the electrical and optical properties of InN, GaN, and AlN

JL Lyons, A Janotti, CG Van de Walle - Physical Review B, 2014 - APS
Carbon is a common impurity in the group-III nitrides, often unintentionally incorporated
during growth. Nevertheless, the properties of carbon impurities in the nitrides are still not …

GaN-based RF power devices and amplifiers

UK Mishra, L Shen, TE Kazior… - Proceedings of the IEEE, 2008 - ieeexplore.ieee.org
The rapid development of the RF power electronics requires the introduction of wide
bandgap material due to its potential in high output power density, high operation voltage …

Carbon impurities and the yellow luminescence in GaN

JL Lyons, A Janotti, CG Van de Walle - Applied Physics Letters, 2010 - pubs.aip.org
Using hybrid functional calculations we investigate the effects of carbon on the electrical and
optical properties of GaN. In contrast to the currently accepted view that C substituting for N …

Buffer design to minimize current collapse in GaN/AlGaN HFETs

MJ Uren, J Moreke, M Kuball - IEEE Transactions on Electron …, 2012 - ieeexplore.ieee.org
The bulk trap-induced component of current collapse (CC) in GaN/AlGaN heterojunction
field-effect transistors is studied in drift diffusion simulations, distinguishing between …

Dynamic on-resistance in GaN power devices: Mechanisms, characterizations, and modeling

S Yang, S Han, K Sheng… - IEEE Journal of Emerging …, 2019 - ieeexplore.ieee.org
Gallium nitride (GaN) power devices enable power electronic systems with enhanced power
density and efficiency. Dynamic on-resistance (R ON) degradation (or current collapse) …

AlGaN/GaN/GaN:C Back-Barrier HFETs With Breakdown Voltage of Over 1 kV and Low

E Bahat-Treidel, F Brunner, O Hilt, E Cho… - … on Electron Devices, 2010 - ieeexplore.ieee.org
A systematic study of GaN-based heterostructure field-effect transistors with an insulating
carbon-doped GaN back barrier for high-voltage operation is presented. The impact of …

Polarity in GaN and ZnO: Theory, measurement, growth, and devices

J Zuniga-Perez, V Consonni, L Lymperakis… - Applied Physics …, 2016 - pubs.aip.org
The polar nature of the wurtzite crystalline structure of GaN and ZnO results in the existence
of a spontaneous electric polarization within these materials and their associated alloys (Ga …