Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5 D Heterogeneous Packages
The growth in 5G, AI, HPC and IoT have been in the rise in the past few years. This
exponential growth has led to research and development of co-packaged optics (CPO) …
exponential growth has led to research and development of co-packaged optics (CPO) …
Machine Learning Enhanced Reflow Profiling Approach
Y Lai - 2024 - search.proquest.com
Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …
numerous surface mount components Reflow profiling is an optimization process to …
Evaluation Airborne Drop Survivability of Electronic Packages
P Yin - 2024 - search.proquest.com
Three types of radiation detectors usually can be found in the market: gas-filled detectors,
scintillation detectors, and solid-state detectors. The ion-chamber type of gas-filled was …
scintillation detectors, and solid-state detectors. The ion-chamber type of gas-filled was …
Improvement of Reflow Soldering Process for Enhanced PCB Component Adhesion: A Computational Study
S Lalithesh - 2024 - search.proquest.com
This thesis focuses on optimizing the reflow soldering process to enhance PCB component
adhesion, employing ANSYS simulation software for a comprehensive analysis. Reflow …
adhesion, employing ANSYS simulation software for a comprehensive analysis. Reflow …