Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5 D Heterogeneous Packages

KA Deo, Y Lai, J Yang, JH Ha… - 2024 IEEE 74th Electronic …, 2024 - ieeexplore.ieee.org
The growth in 5G, AI, HPC and IoT have been in the rise in the past few years. This
exponential growth has led to research and development of co-packaged optics (CPO) …

Machine Learning Enhanced Reflow Profiling Approach

Y Lai - 2024 - search.proquest.com
Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …

Evaluation Airborne Drop Survivability of Electronic Packages

P Yin - 2024 - search.proquest.com
Three types of radiation detectors usually can be found in the market: gas-filled detectors,
scintillation detectors, and solid-state detectors. The ion-chamber type of gas-filled was …

Improvement of Reflow Soldering Process for Enhanced PCB Component Adhesion: A Computational Study

S Lalithesh - 2024 - search.proquest.com
This thesis focuses on optimizing the reflow soldering process to enhance PCB component
adhesion, employing ANSYS simulation software for a comprehensive analysis. Reflow …